High Flow Phase Change Interface Materials

High Flow Phase Change Materials

A complete range of choices for filling air gaps and enhancing thermal conductivity

Use phase change materials for excellent thermal performance without the mess of grease Hi-Flow® “phase change” materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. Hi-Flow materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface – without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle.

The ho-Flow family of phase change thermal interface materials covers a wide range of applications. The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified.

Hi-Flow handles like Bergquist’s famed SIL-Pad® materials at room temperature, but flows like grease at its designed phase change temperature. Following is an overview of the important features shared by the hi-Flow family.
  • Comparable thermal performance to grease in most applications
  • Thermally conductive phase change compound
  • Aluminum, film or fiberglass carriers and non-reinforced versions
  • Low volatility
  • Easy to handle and apply in the manufacturing environment
  • Tackified or tack-free at room temperature
Hi-Flow handles like Bergquist’s famed SIL-Pad® materials at room temperature, but flo
  • No mess – thixotropic characteristics of materials keep it from flowing out of the interface
  • Easier handling – tackified or tack-free at room temperature
  • Does not require protective liner
  • High thermal performance helps ensure CPU reliability
  • Does not attract contaminants
  • Easier material handling and shipping
  • Simplified application process
The broad Hi-Flow family offers a variety of choices to meet the customer’s performance, handling and process needs. Some of the choices include:
  • Available with or without adhesive
  • Aluminum carrier for applications not requiring electrical isolation
  • Dry, non-reinforced material
  • Tackified or tack-free at room temperature
  • Tabbed parts, punch parts, sheets or rolls
  • Adhesive specifically for cold application without preheating heat sink
Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications application such as:
  • UPS and SMPS AC/DC, DC/DC or linear power supplies
  • Between a CPU and a heat sink
  • Power conversion devices
  • Fractional and integral motor control
  • Leaded, surface mount and power module assemblies

High Flow Phase Change Materials

High-Flow® Comparison Data

Insulating Comparison: Hi-Flow 625 and Hi-Flow 818-AC

Non-Insulating Comparison: Hi-Flow 115-AC / Hi-Flow 200G / Hi-Flow 10

Download the Hi-Flow Comparison Table

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