TIC - Thermal Interface Compounds

Thermal Interface Compounds

Thermally Conductive Grease Compounds

Bergquist’s line of thermally conductive thermal interface compounds will flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance. TIC products are designed for use between a high-end computer processor and a heat sink or other high watt density applications.
The TIC portfolio has diversethermal and electrical characteristics. Key criteria when selecting TIC products include:
  • Viscosity
  • Volume resistivity
  • Thermal conductivity
  • Thermal performance
  • Filler size
TIC products are ideal for high watt density applications. Primary benefits include:
  • Low interfacial resistance
  • Low thermal impedance
  • Resists dripping
  • Ideally suited to screen printing applications
  • No post “cure” conditioning required
TIC products can be obtained with application-specific options such as:
  • Containers
Some Gap Pad products have special features for particular applications, including:
  • CPU
  • GPU
  • IGBT
  • High power density applications

SUPPORT FAQs

Common Questions About Our Products

What is the best fastening method for a TIC interface?
A: A constant-pressure fastener is preferred when using TIC for high performance applications.The constant pressure from a clip or spring washer will ensure adequate pressure is being applied with varying bond line thickness.
Screenprinting the TIC is a fast, low-cost method that delivers a consistent and accurate amount of material on each application. Alternate methods include stenciling, pin transfer and needle dispensing.
All the TIC materials were specifically designed to resist pump-out of the interface, even after many hours of thermal and power cycling.

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