Adhesive Tapes / Bond Ply
Bond-Ply Materials
SIL-PAD Construction
SIL-PAD Construction are designed to retain high bond strength to a variety of surfaces and to maintain long term exposure to moderate heat & high humidity. Use these materials instead of, heat cure adhesives, screw mounting and clip mounting applications.
The Bond-Ply family of materials are thermally conductive and electrically isolating. Bond-Ply is available in a PSA or laminating format, is reinforced with fiberglass or film and comes in a variety of different thicknesses. Bond-Ply provides for the mechanical decoupling of bonded materials with mismatched thermal coefficients of expansion, typical applications include:
- Bonding bus bars in a variety of electronic modules and sub assemblies
- Attaching a metal-based component to a heat sink
- Bonding a heat sink to a variety of ASIC, graphic chip, and CPU packages
- Bonding flexible circuits to a rigid heat spreader or thermal plane
- Assembly tapes for BGA heat spreader
| Product | Colour | Thickness | Thermal Con... | Datasheet |
|---|---|---|---|---|
| Bond-Ply® 100 | White | 0.005, 0.008, 0.011 | 0.8 |  |
| Bond-Ply® 400 | White | 0.005 | 0.4 | |
| Bond-Ply® 660B | White | 0.0055 | 0.4 | |
| Liqui-Bond® SA 2000 (one-part) | Yellow | - | 2.0 | |
| Liqui-Bond® SA 1000 (One-Part) | Black | - | 1.0 | |
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