| Material |
Description |
Advantages |
| HT |
2.2 W/mK. Better thermal performance. High Tg epoxy formulation. Purchased as panels, parts or coated onto foil. Available in 0.003" to 0.006" thickness dielectric. |
• Same thrmal performance as LTI with the added
benefit of very stable electrical properties at high temperature. |
| LTI |
2.2 W/mK. Better thermal performance. Standard epoxy formulation. Purchased as panels, parts or coated onto foil. Available in 0.003" to 0.006" thickness dielectric. |
• Offers lower thermal impedance (~25%) in the application
• Used formally in conjunction with copper base formaximum thermal performance. |
| MP |
1.3 W/mK. General purpose dielectric. Standard epoxy formulation. Purchased as panels, parts or stand-alone laminating material. Available in 0.003" to 0.006" thickness dielectric. |
• Flexible and robust.
• Fits most application well.
• Uses - Power, motor controls, etc. |
| CML |
1.1 W/mK. Epoxy coated fiberglass. Standard epoxy formulation. Purchased as panels, parts or stand-alone laminating material. Available in 0.006" thickness dielectric. Can be stacked two high for 0.010" to 0.012" dielectric. |
• Easy to handle for custom-built parts.
• Supplied as prepreg in sheet or roll form. |
