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TIC™  >> Thermal Interface Compounds
  Thermally Conductive Grease Compounds
Bergquist’s line of thermally conductive thermal interface compounds will flow under assembly pressure to wet-out the thermal interface surfaces and produce very low thermal impedance. TIC products are designed for use between a high-end computer processor and a heat sink or other high watt density applications.


The TIC portfolio has diversethermal and electrical characteristics. Key criteria when selecting TIC products include:

Volume resistivity
Thermal conductivity
Thermal performance
Filler size



TIC products are ideal
for high watt density applications. Primary
benefits include:

Low interfacial resistance
Low thermal impedance
Resists dripping
Ideally suited to screen printing applications
No post “cure” conditioning required



TIC products can be obtained with application-specific options such as:




Some Gap Pad products have special features for particular applications, including:

High power density applications

TIC 1000G
High Performance, Value Compound for High-End Computer Processors.
  TIC 1000A
High Performance, Value Compound for High-End Computer Processors.

TIC 4000
High Performance Thermal Interface Compound for Copper-Based Heat Sinks.

Comparison Data and FAQs Q: What is the best fastening method for a TIC interface?
A: A constant-pressure fastener is preferred when using TIC for high performance applications.The constant pressure from a clip or spring washer will ensure adequate pressure is being applied with varying bond line thickness.

Q: How should the TIC be applied?
A: Screenprinting the TIC is a fast, low-cost method that delivers a consistent and accurate amount of material on each application.
Alternate methods include stenciling, pin transfer and needle dispensing.

Q: Will the grease stay in the interface?
A: All the TIC materials were specifically designed to resist pump-out of the interface, even after many hours of thermal and power
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