Features
The TIC portfolio has diversethermal and electrical characteristics. Key criteria when selecting TIC products include:
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Viscosity |
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Volume resistivity |
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Thermal conductivity |
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Thermal performance |
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Filler size |
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Benefits
TIC products are ideal
for high watt density applications. Primary
benefits include:
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Low interfacial resistance |
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Low thermal impedance |
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Resists dripping |
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Ideally suited to screen printing applications |
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No post “cure” conditioning required |
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Options
TIC products can be obtained with application-specific options such as:
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Applications
Some Gap Pad products have special features for particular applications, including:
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CPU |
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GPU |
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IGBT |
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High power density applications |
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TIC 1000G
High Performance, Value Compound for High-End Computer Processors.
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TIC 1000A
High Performance, Value Compound for High-End Computer Processors. |
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TIC 4000
High Performance Thermal Interface Compound for Copper-Based Heat Sinks.
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