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Hi-Flow 105
Phase Change Coated Aluminum.
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Hi-Flow 115-AC
Fiberglass-Reinforced, Phase Change Thermal Interface Material. |
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Hi-Flow 225 F-AC
Reinforced, Phase Change Thermal Interface Material.
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Hi-Flow 225FT
Reworkable, Pressure Sensitive Phase Change Material. |
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Hi-Flow 225UF
Unsupported, Thermally Conductive Phase Change Material. |
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Hi-Flow 225UT
Non-Reinforced, Pressure Sensitive Phase Change Thermal Interface Material. |
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Hi-Flow 225U
Non-Reinforced Phase Change Thermal Interface Material. |
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Hi-Flow 625
Electrically Insulating, Thermally Conductive Phase Change Material. |
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Hi-Flow 300P
Electrically Insulating, Thermally Conductive Phase Change Material. |
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Hi-Flow 300G
Fiberglass-Reinforced, Phase Change Thermal Interface Material. |
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TIC 1000G
High Performance, Value Compound for High-End Computer Processors. |
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TIC 1000A
High Performance, Value Compound for High-End Computer Processors. |
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TIC 4000
High Performance Thermal Interface Compound for Copper-Based Heat Sinks. |
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