Features
Hi-Flow handles like Bergquist's famed SIL-Pad® materials at room temperature, but flows like grease at its designed phase change temperature. Following is an overview of the important features shared by the hi-Flow family.
| • |
Comparable
thermal performance to grease in most applications |
| • |
Thermally
conductive phase change compound |
| • |
Aluminum,
film or fiberglass carriers and non-reinforced versions |
| • |
Low
volatility |
| • |
Easy
to handle and apply in the manufacturing environment |
| • |
Tackified
or tack-free at room temperature |
|
|
Benefits
Hi-Flow handles like Bergquist's famed SIL-Pad® materials at room temperature, but flo
| • |
No
mess – thixotropic characteristics of materials
keep it from flowing out of the interface |
| • |
Easier
handling – tackified or tack-free at room temperature |
| • |
Does
not require protective liner |
| • |
High
thermal performance helps ensure CPU reliability |
| • |
Does
not attract contaminants |
| • |
Easier
material handling and shipping |
| • |
Simplified
application process |
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|
Options
The broad Hi-Flow family offers a variety of choices to meet the customer's performance, handling and process needs. Some of the choices include:
| • |
Available
with or without adhesive |
| • |
Aluminum
carrier for applications not requiring electrical
isolation |
| • |
Film
or fiberglass carrier for electrical isolation |
| • |
Dry,
non-reinforced material |
| • |
Tackified
or tack-free at room temperature |
| • |
Tabbed
parts, punch parts, sheets or rolls |
| • |
Adhesive
specifically for cold application without preheating
heat sink |
|
|
Applications
Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications application such as:
| • |
UPS
and SMPS AC/DC, DC/DC or linear power supplies |
| • |
Between
a CPU and a heat sink |
| • |
Power
conversion devices |
| • |
Fractional
and integral motor control |
| • |
Leaded,
surface mount and power module assemblies |
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