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Phase Change Materials  >> High-Flow®

Use phase change materials for excellent thermal performance without the mess of grease
Hi-Flow® "phase change" materials are an excellent replacement for grease as a thermal interface between a CPU or power device and a heat sink. Hi-Flow materials change from a solid at specific phase change temperatures and flow to assure a total wet-out of the interface – without overflow. The result is a thermal interface comparable to grease, without the mess, contamination and hassle.

The ho-Flow family of phase change thermal interface materials covers a wide range of applications. The Bergquist Company is a leader in thermal management solutions and works closely with customers to ensure that the proper Hi-Flow material is specified.



Hi-Flow handles like Bergquist's famed SIL-Pad® materials at room temperature, but flows like grease at its designed phase change temperature. Following is an overview of the important features shared by the hi-Flow family.

Comparable thermal performance to grease in most applications
Thermally conductive phase change compound
Aluminum, film or fiberglass carriers and non-reinforced versions
Low volatility
Easy to handle and apply in the manufacturing environment
Tackified or tack-free at room temperature



Hi-Flow handles like Bergquist's famed SIL-Pad® materials at room temperature, but flo

No mess – thixotropic characteristics of materials keep it from flowing out of the interface
Easier handling – tackified or tack-free at room temperature
Does not require protective liner
High thermal performance helps ensure CPU reliability
Does not attract contaminants
Easier material handling and shipping
Simplified application process


The broad Hi-Flow family offers a variety of choices to meet the customer's performance, handling and process needs. Some of the choices include:

Available with or without adhesive
Aluminum carrier for applications not requiring electrical isolation
Film or fiberglass carrier for electrical isolation
Dry, non-reinforced material
Tackified or tack-free at room temperature
Tabbed parts, punch parts, sheets or rolls
Adhesive specifically for cold application without preheating heat sink


Hi-Flow materials are suited for consumer and industrial electronics, automotive, medical, aerospace and telecommunications application such as:

UPS and SMPS AC/DC, DC/DC or linear power supplies
Between a CPU and a heat sink
Power conversion devices
Fractional and integral motor control
Leaded, surface mount and power module assemblies
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