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Gap Pad   >> Thermally Conductive Materials
  A complete range of choices for filling air gaps and enhancing thermal conductivity.
The Bergquist company developed Gap Pad to meet the electronics industry's growing need for interface materials with greater conformability, higher thermal performance and easier application. The Gap Pad family provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. Bergquist application specialists work closely with customers to specify the proper Gap Pad material for each unique thermal management requirement.


Each of the many products within the Gap Pad family is unique in its construction, properties and performance. Following is an overview of the important features offered by the Gap Pad family:

Low-modulus polymer materials
Available with fiberglass / rubber carriers or in a non-reinforced version
Special fillers to achieve specific thermal and conformability characteristics
Highly conformable to uneven and rough surfaces
Electrically isolating
Naturally tacky one-side or tacky on both sides with protective liner
Variety of thicknesses and hardnesses
Range of thermal conductivities
Available in sheets and die-cut parts


Gap Pad thermal products are designed to improve an assembly's thermal performance and reliability while saving time and money, specifically:

Eliminates air gaps to reduce thermal resistance
Highly conformability reduces interfacial resistance
Low-stress vibration dampening
Shock absorbing
Easy material handling
Simplified application
Puncture, shear and tear resistance
Improved performance for high-heat assemblies
Compatible with automated dispensing equipment


Some Gap Pad products have special features for particular applications, including:

Available with or without adhesive
Rubber-coated fiberglass reinforcement
Thicknesses from 0.010" to 0.250"
Available in custom die-cut parts, sheets and rolls (converted or unconverted)
Custom thicknesses and constructions
Adhesive or natural inherent tack


Gap Pad products are well suited to a wide variety of electronics, automotive, medical, aerospace and military applications such as:

Between an IC and a heat sink or chassis. Typical packages include BGA's, QFP, SMT power components and magnetics
Between a semiconductor and heat sink
CD-Rom/DVD cooling
Between heat generating devices and chassis
Heat pipe assemblies
RDRAM memory modules
Hard Drive cooling
Power supply
Signal amplifiers
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