Features
Each of the many products within the Gap Pad family is unique in its construction, properties and performance. Following is an overview of the important features offered by the Gap Pad family:
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Low-modulus polymer materials |
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Available with fiberglass / rubber carriers or in a non-reinforced version |
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Special fillers to achieve specific thermal and conformability characteristics |
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Highly conformable to uneven and rough surfaces |
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Electrically isolating |
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Naturally tacky one-side or tacky on both sides with protective liner |
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Variety of thicknesses and hardnesses |
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Range of thermal conductivities |
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Available in sheets and die-cut parts |
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Benefits
Gap Pad thermal products are designed to improve an assembly's thermal performance and reliability while saving time and money, specifically:
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Eliminates air gaps to reduce thermal resistance |
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Highly conformability reduces interfacial resistance |
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Low-stress vibration dampening |
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Shock absorbing |
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Easy material handling |
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Simplified application |
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Puncture, shear and tear resistance |
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Improved performance for high-heat assemblies |
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Compatible with automated dispensing equipment |
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Options
Some Gap Pad products have special features for particular applications, including:
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Available with or without adhesive |
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Rubber-coated fiberglass reinforcement |
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Thicknesses from 0.010" to 0.250" |
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Available in custom die-cut parts, sheets and rolls (converted or unconverted) |
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Custom thicknesses and constructions |
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Adhesive or natural inherent tack |
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Applications
Gap Pad products are well suited to a wide variety of electronics, automotive, medical, aerospace and military applications such as:
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Between an IC and a heat sink or chassis. Typical packages include BGA's, QFP, SMT power components and magnetics |
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Between a semiconductor and heat sink |
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CD-Rom/DVD cooling |
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Between heat generating devices and chassis |
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Heat pipe assemblies |
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RDRAM memory modules |
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Hard Drive cooling |
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Power supply |
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Signal amplifiers |
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