>> about us    >> contact us     >> make enquiry     >> legal stuff ph   +61 (0)2 9683 5006
 
 
sil_pads
 
> Thermally Conductive
    Interface Materials
   • Introduction
   • Sil-Pads
   • Gap Pads
        - Gap Filling Materials
        - FAQs
   • Adhesive Tapes / Bond Ply
   • TIC - Thermal Interface       Compounds
   • High-Flow Phase Change       Interface Materials
         - Products
         - Comparison Data
   • Sil-Pad Selection Guide
   • Sil-Pad Configurations
   • Applications
 
 
> Thermal Clad  
> Touch Screens  
> Anti-Static Products
    ACL Staticide		  
 
 
Thermally Conductive Adhesive Tapes   >> Bond-Ply Materials
 
  SIL-PAD Construction
are designed to retain high bond strength to a variety of surfaces and to maintain long term exposure to moderate heat & high humidity. Use these materials instead of, heat cure adhesives, screw mounting and clip mounting applications.
   
 
       
Bond-Ply100
Thermally Conductive, Fiberglass Reinforced Pressure Sensitive Adhesive Tape.
   Bond-Ply400
High Cut-Through Resistant, Electrically Insulating, Thermally Conductive Material.		  

Bond-Ply660
Economical, Electrically Insulating, Thermally Conductive, Soft Tack Elastomeric Material.

    
             
Thermally Conductive Liquid Adhesive
         
Liqui Bond SA 2000 (one-part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive.		   Liqui Bond SA 1000 (one-part)
Thermally Conductive, One-Part, Liquid Silicone Adhesive.		        
 
 
  Phone: +61 (0)2 9683 5006  
  All © Copyright TJK Technologies
Web Site: b.b.advertising		 About Us  I  Contact Us  I  Thermal Interface Materials  I  Thermal Clad  I  Touch Screens  I  ACL Staticide